New research offers an enhanced understanding of common defects in transition-metal dichalcogenides (TMDs) -- a potential replacement for silicon in computer chips -- and lays the foundation for ...

Utilizing laser scanning, OBIC provides spatially resolved photocurrent maps in integrated circuits, crucial for effective ...

Researchers created a high-resolution 3D ultrasonic imaging system for concrete that uses broadband ultrasonic signals to automatically adapt to different types of concrete structures. WASHINGTON, Jan ...

Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...

AI plays a role in improving defect capture rate and distinguishing between yield-killing and nuisance defects. New developments in wafer edge inspection are proving essential to bonded wafer yields.