WEST LAFAYETTE, Ind. – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to ...

WEST LAFAYETTE, Ind. — Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on ...

The maritime transport sector is one of the most energy-intensive and difficult industries to decarbonize. Despite significant improvements in propulsion ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

KISSIMMEE, Fla.--(BUSINESS WIRE)--BRIDG, a not-for-profit, public-private partnership specializing in advanced system integration and packaging, today announced the U.S. Department of Defense-funded ...

Intel (INTC) stock rises as company appoints former SK Hynix CEO Seok-Hee Lee to lead advanced packaging and manufacturing at ...

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

How integration of data and systems help enterprises achieve IT success. Why cloud integration is a key strategy among many businesses. How does data integration streamline complex on-premises and ...

On October 9, Shenzhen Hangsheng Electronics Co., Ltd. (HSAE) and global automotive safety systems supplier Autoliv signed an agreement to establish a joint venture in China dedicated to advanced ...